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    Basic Information

Technology developed: Adaptive Ultrasonic-assisted Elevated Temperature Double Sided Incremental Sheet Forming Technique (TP19767178895)
Category: Product (Hardware/Material/Software)
Details of Inventor(s):
Inventor Institution/Organization/Company Department Designation
Prof Puneet Tandon PDPM, Indian Institute of Information Technology, Design and Manufacturing Jabal ME Professor
Technical Application Area: Other
If 'Other', please specify:
Automobile, Biomedical Engg., Defence, Aerospace, Nuclear sciences
Please give more details of new technical application area:
Organization(s):
PDPM Indian Institute of Information Technology Design and Manufacturing (IIITDM) Jabalpur
Affiliated Ministry: MHRD, Govt. of India
Type of technology development: Indigenous
Does the technology help in replacing any import items currently
procured from outside India?
Yes
Does the technology have export potential? Yes
Category of Technology developed: Immediate Deployment
Stage of Development: Field Test
Please describe in detail including the TRL Level:
Incremental Forming (IF) is a dieless manufacturing technique, in which sheet metal is plastically deformed to the desired shape of the product, by a series of small incremental steps using a punch. However, parts formed by IF suffer from poor geometrical accuracy, high surface roughness and formability issues, which limits its use in industry. This project proposes the development of a novel Double-Sided Incremental Forming (DISF) technology by integrating adaptive and dynamic support tool path strategies with ultrasonic vibrations assisted sheet forming strategies at room temperature and elevated temperature (i.e., warm forming), aka ET-IF to achieve improved product quality. The TRL level of the technology is TRL 7.

    Abstract:

Applications: The applications of the technology is in ready to use customized or low-batch size products development in the domains of Automobile, Biomedical Engineering, Defense, Aerospace, Nuclear sciences.
Advantages: The advantages that allow ISF to be developed as a viable solution for sheet metal products can be listed as follows: 1. The technology is very convenient to produce customized/low-batch sized parts, as it does not require process or part specific tooling due to which the setup costs is largely negligible. 1.ISF is a highly flexible process, and it is possible to simply modify the machine part program so that the product shape is changed. 2.Due to the stress state induced during tool movement, the formability is greater than that of traditional stamping. 3.ISF is suitable to make parts for replacement, such as for automotive parts where there is a lack of dies and tooling for a one-off part, and it can also be used for rapid prototyping of new products. 4.The contact surface is small, and the forces during the forming process are low so the amount of lubricant required is reduced as compared to conventional sheet metal forming.

    Technology Inputs:

Imported Equipment/Spare Parts:
Equipment/Spare Parts Year ITC-HS Code
Tix560 Thermal Camera (Make: Fluke) 2018-19
Indigenous Equipment/Spare Parts:
Equipment/Spare Parts Year ITC-HS Code
10 axis Double-Sided Incremental Forming Machine NA
Imported Raw Materials:
Raw Materials Year ITC-HS Code
NA
Indigenous Raw Materials:
Raw Materials Year ITC-HS Code
Sheet metals of alloys of Aluminium, Titanium, steel and copper NA
Existing R&D Facilities used:
Facilities Year ITC-HS Code
NA

   Patents & Publications:

Patents:
Filed Patents (No.) Granted Patents (No.) Year
0 0 NA
Publications:
Submitted (No.) Published (No.) Year
3 1 2019-20

    Commercialization Potential:

Who are the Potential Licensees? Biomedical equipment and implants manufacturers, Aerospace and Automobile compnies, companies making components of nuclear power plant, etc. Some of them under discussion are 1. Boeing India Ltd. 2. DAE,Board Of Research In Nuclear Sciences (BRNS), 3. MediCad Implants, Coimbatore, 4 Shree Pacetronix Ltd., Indore.
What commercially available products address
the same problem?
Company Product Problem Addressed
Would you like to develop this invention further with
corporate research support?
Yes
Would you be interested in participating in cluster based
programs for commercialization research or business
planning for your invention?
Yes
      Submitted by: Institute User Date of Submission: 4-8-2020



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