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    Basic Information

Technology developed: DHD based through thickness residual stress measurement (TP19767436342)
Category: Technology Service/Know how
Details of Inventor(s):
Inventor Institution/Organization/Company Department Designation
M M Mahapatra IIT Bhubaneswar School of Mechanical Sciences Asso Prof
Technical Application Area: Engineering
If 'Other', please specify:
Please give more details of new technical application area:
Through thickness residual stress measurement in thick engineering comonents by the deep hole drilling technique
Organization(s):
Indian Institute of Technology (IIT) Bhubaneswar
Affiliated Ministry: Ministry of Education
Type of technology development: Indigenous
Does the technology help in replacing any import items currently
procured from outside India?
Yes
Does the technology have export potential? Yes
Category of Technology developed: Immediate Deployment
Stage of Development: Field Test
Please describe in detail including the TRL Level:
The technology has been developed realised and currently used in the measurement of through thickness residual stress

    Abstract:

Applications: It is currently used in the measurement of residual stress in thick welded joints, thick forged components
Advantages: The existing technology available in the country is only applicable to measure surface level residual stresses. The developed technology is capable to measure residual stresses in thick engineering component through thickness up to 250 mm thick

    Technology Inputs:

Imported Equipment/Spare Parts:
Equipment/Spare Parts Year ITC-HS Code
NA
Indigenous Equipment/Spare Parts:
Equipment/Spare Parts Year ITC-HS Code
Indegenous componets used for developing the technique NA
Imported Raw Materials:
Raw Materials Year ITC-HS Code
NA
Indigenous Raw Materials:
Raw Materials Year ITC-HS Code
Indegenously available components 2019-20
Existing R&D Facilities used:
Facilities Year ITC-HS Code
School of Mechanical Sciences 2019-20

   Patents & Publications:

Patents:
Filed Patents (No.) Granted Patents (No.) Year
0 0 NA
Publications:
Submitted (No.) Published (No.) Year
0 4 2018-19

    Commercialization Potential:

Who are the Potential Licensees? Heavy industries, ship building industries, powerplant machinary building indutries
What commercially available products address
the same problem?
Company Product Problem Addressed
Would you like to develop this invention further with
corporate research support?
Yes
Would you be interested in participating in cluster based
programs for commercialization research or business
planning for your invention?
Yes
      Submitted by: INSTITUTION HEAD Date of Submission: 5-8-2020



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